P.R. Solvent Free Primer is based on a blend of Epoxy Resin and Curing Agent binder giving the low viscosity characteristics necessary to wet the substrate, giving good penetration properties.

Application:

P.R. Solvent Free Primer is designed for use on a variety of substrates. The substrate is primed prior to the application of P.R. Solvent Free Coating, P.R. Self Levelling Flooring System No 2, P.R. Screed System or P.R. Patch Repair System.